India's first 3D Glass Chip Packaging Unit Begins Work in Odisha

Odisha has taken a major step into advanced electronics manufacturing as work begins on India’s first 3D Glass Chip Packaging Unit at Info Valley in Bhubaneswar.

The project, led by Heterogeneous Integration Packaging Solutions Pvt Ltd, was approved under the India Semiconductor Mission in August 2025 and involves an investment of about Rs 1,943 crore.

The 3D Glass Chip Packaging Unit is set to position Odisha among emerging global hubs for next-generation chip packaging.

Once operational, the facility will produce 70,000 glass panels annually, along with 50 million assembled units and around 13,000 advanced 3DHI modules. It is also expected to create more than 2,500 direct and indirect jobs, boosting the state’s tech ecosystem.

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Backed by US technology, the company specializes in glass-based RF and millimeter-wave packaging substrates. CEO Babu Mandava said packaging is central to semiconductor performance. “We are here to build large substrates with high dimensional stability and very high interconnect density, along with very low loss. Our goal is to develop the most sophisticated technology and build an advanced fabrication unit with the highest capacity. This is just the beginning,” he said.

Lip-Bu Tan, CEO of Intel Corporation joined the event virtually, calling it a key milestone for innovation and global collaboration. Chief Minister Mohan Charan Majhi said the project reflects Odisha’s shift toward high-value industries, while Union Minister Ashwini Vaishnaw highlighted India’s rapid growth in electronics manufacturing.

Unlike traditional units, the plant will focus on advanced glass substrate packaging and 3D integration technologies. These enable faster, energy-efficient chips used in AI, IoT, aerospace, defense, and next-generation data centers, strengthening India’s semiconductor supply chain.