Paras-BroadPak's Rs 6,200 Cr Semiconductor Packaging Facility

A Rs 6,200 crore semiconductor packaging facility will be established in Madhya Pradesh through a partnership between Paras Semiconductors and US-based BroadPak Corporation.

The project, planned along the Ujjain-Indore corridor, will begin with a monthly capacity of 10,000 wafers, with plans to scale beyond 50,000 wafers.

The partnership also targets more than 10 million packaged units per month at full production.

With around 90 percent of output intended for exports, the facility could give India a larger role in the global semiconductor supply chain.

Its production roadmap, technology partnerships and customer pipeline will be key to achieving these ambitions.

What are the Production Capacity and Export Target of the Facility?

The proposed semiconductor packaging facility will be developed in phases, with an initial capacity of 10,000 wafers per month, with plans to increase the capacity over time to more than 50,000 wafers monthly over the next six to seven years.

At full production capacity, the facility is expected to manufacture more than 10 million packaged units every month.

The company is also targeting an export share of approximately 90 percent, with key markets including:

• United States and Europe
• Taiwan and South Korea
• Singapore and Malaysia

Santosh Kumar, CEO of Paras Semiconductors, said the company is targeting USD 1 billion in revenue over the next decade.

However, the production ramp-up will depend on customer and product qualification, an important step before semiconductor components can enter commercial markets.

Also Read: Why Contextual Industrial Data Is Critical for AI-Ready Manufacturing in India

What will be BroadPak’s Role in the Partnership?

BroadPak will contribute design integration expertise, package-level system architecture, manufacturing know-how and intellectual property.

BroadPak's technology portfolio will include:

• Hybrid bonding for connecting semiconductor components.
• Advanced redistribution layer (RDL) processes, with line widths and spacing of around one micron.
• Heterogeneous integration, which combines multiple dies or chiplets within a single package.

These capabilities are intended to serve growing demand from artificial intelligence (AI), high-performance computing (HPC), networking and data centers.

According to BroadPak Corporation President and CEO Farhang Yazdani, integrating multiple chiplets into a single package boosts performance and cuts power consumption—though it requires robust package-level design and system architecture to work efficiently.

Investment, Funding and Project Execution

The project involves a proposed capital expenditure of Rs 6,200 crore spread over six years. Construction is expected to begin in Q1 2027, with commercial production targeted for Q4 2028.

Project developments include:

• Approval status: The Madhya Pradesh government has approved the project.
• Incentives: The company plans to apply for incentives under India Semiconductor Mission 2.0.
• Letters of intent have been received from prospective customers.

The central government's approval and associated incentives are yet to be secured.

At full scale, the facility is expected to generate approximately 2,500 direct and 10,000 indirect jobs. The company also expects more than 90 percent of its workforce to be locally recruited.