Continental Device India Pvt. Ltd. (CDIL), which abandoned wafer fabrication 15 years ago, may eventually establish its own fabrication facility in India, according to a top executive, providing the nation develops an enabling ecosystem. In the interim, it is concentrating on its local ATMP (assembly, testing, marking, and packaging) business and increasing its 500 million unit capacity by an additional 100 million units.
Prithvideep Singh, general manager of CDIL Semiconductors, the company would rely on the government's production-linked incentive (PLI) program and the Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS) to establish two new ATMP lines.
"We'll increase capacity by 100 million units. The first phase of this particular plan has already been put in place. In the next six to eight months, another 50 million units will arrive, according to Singh, the grandson of Gurpreet Singh, who founded CDIL in 1964 and began producing silicon chips and devices in partnership with Continental Device Corp. of Hawthorne, California, later known as Teledyne Semiconductor Co.
The international corporation Micron announced the opening of an ATMP unit in India with an investment of over $800 million over five years just before the Indian company's expansion. Singh omitted to mention the investment his business will make to increase the capacities.